28 lines
1.1 KiB
Text
28 lines
1.1 KiB
Text
|
Summary
|
||
|
=======
|
||
|
This README assumes you have read README.da850. It contains some additional
|
||
|
information specific to building the omapl138-lcdk. The AIS file as generated
|
||
|
by the build is, currently, not useable due to differences in the flash
|
||
|
available on this board, as compared to the da850evm boards.
|
||
|
|
||
|
Flash Differences
|
||
|
=================
|
||
|
Refer to the discussion in [1] for more detail - basically the da850evm uses
|
||
|
SPI flash whereas the lcdk uses NAND flash to store the bootloader, and
|
||
|
the support isn't there in the SPL code.
|
||
|
|
||
|
It should be possible to add the support in the SPL code should someone be
|
||
|
sufficiently motivated.
|
||
|
|
||
|
Using the built image
|
||
|
=====================
|
||
|
The output image to use is u-boot.bin. This needs to be converted to an
|
||
|
AIS file as described in [1] and then flashed using the utitilty linked to
|
||
|
there and also described in README.da850. You _may_ be able to write using
|
||
|
u-boot itself, but the commands in README.da850 won't work as they write to
|
||
|
SPI rather than NAND.
|
||
|
|
||
|
Links
|
||
|
=====
|
||
|
[1]
|
||
|
http://e2e.ti.com/support/dsp/omap_applications_processors/f/42/t/386829
|